Growth rate of fine grains formed by diffusion induced recrystallization in Ni layer of Cu/Ni/Cu diffusion couples

Materials Transactions, JIM

Volumn 39, Issue 1, 1998, Pages 218-224

  Kawanami, Yasuhiko ^a   Nakano, Masahiko ^a   Kajihara, Masanori ^a   Mori, Tsutomu ^a,b  

^a TOKYO INSTITUTE OF TECHNOLOGY   (Japan)

^b Ryobi Limited   (Japan)

Author keywords

Diffusion induced recrystallization; Grain boundary diffusion; Grain boundary migration; Nickel copper system

Indexed keywords

COPPER; CRYSTALLIZATION; DIFFUSION; GRAIN BOUNDARIES; GRAIN GROWTH; NICKEL;

DIFFUSION COUPLES; DIFFUSION INDUCED RECRYSTALLIZATION;

INTERMETALLICS;

EID: 0031675684     PISSN: 09161821     EISSN: None     Source Type: Journal    
DOI: 10.2320/matertrans1989.39.218     Document Type: Article

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