Mechanical properties of Cu-Al-O thin films prepared by plasma-enhanced chemical vapor deposition

Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films

Volumn 24, Issue 3, 2006, Pages 537-541

  Chen, Wen ^a   Gong, Hao ^a   Zeng, Kaiyang ^a  

^a NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

ATOMIC FORCE MICROSCOPY; ELASTIC MODULI; GRAIN BOUNDARIES; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; SECONDARY ION MASS SPECTROMETRY; THIN FILMS;

COPPER ALUMINUM OXIDE THIN FILMS; FILM MATRIX; NANOINDENTATION;

COPPER ALLOYS;

EID: 33646558961     PISSN: 07342101     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.2191860     Document Type: Article

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