In-situ high temperature X-ray diffraction study of Cu/Al2O3 interface reactions

Acta Materialia

Volumn 46, Issue 9, 1998, Pages 3057-3061

  Fujimura, Toru ^a   Tanaka, Shun Ichiro ^a  

^a JAPAN SCIENCE AND TECHNOLOGY AGENCY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVATION ENERGY; ALUMINA; COPPER; COPPER OXIDES; DIFFUSION IN SOLIDS; REACTION KINETICS; STRESS ANALYSIS; SURFACE PHENOMENA; THERMAL EXPANSION; THERMAL VARIABLES MEASUREMENT; X RAY DIFFRACTION ANALYSIS;

PARABOLIC RATE LAW; THERMAL EXPANSION COEFFICIENTS;

INTERFACES (MATERIALS);

EID: 0032058286     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1359-6454(98)00002-0     Document Type: Article

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