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Volumn 892, Issue , 2006, Pages 389-394
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Flip-chip mounting for improved thermal management of AlGaN/GaN HFETs
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Author keywords
[No Author keywords available]
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Indexed keywords
FLIP CHIP DEVICES;
GALLIUM NITRIDE;
HETEROJUNCTIONS;
RAMAN SPECTROSCOPY;
THERMAL CONDUCTIVITY;
THERMOGRAPHY (IMAGING);
3D TEMPERATURE SIMULATIONS;
DEVICE THERMAL MANAGEMENT;
FLIP-CHIP CONTACT BUMP LAYOUT;
MICRO-RAMAN SPECTROSCOPY;
FIELD EFFECT TRANSISTORS;
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EID: 33646424106
PISSN: 02729172
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
Times cited : (4)
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References (8)
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