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Volumn 48, Issue 12, 2000, Pages 2573-2578
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A 3-10-ghz gan-based flip-chip integrated broad-band power amplifier
a a a a a a |
Author keywords
Broad band; Flip chip bonding; Gan high electron mobility transistors (hemts); Power amplifier
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Indexed keywords
BANDWIDTH;
BROADBAND AMPLIFIERS;
ELECTRIC NETWORK TOPOLOGY;
FLIP CHIP DEVICES;
HIGH ELECTRON MOBILITY TRANSISTORS;
SAPPHIRE;
SEMICONDUCTING GALLIUM COMPOUNDS;
ALUMINUM NITRIDE;
FLIP-CHIP BONDING;
GALLIUM NITRIDE;
POWER AMPLIFIERS;
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EID: 0034429090
PISSN: 00189480
EISSN: None
Source Type: Journal
DOI: 10.1109/22.899015 Document Type: Article |
Times cited : (47)
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References (6)
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