Measurement of temperature distribution in multifinger AlGaN/GaN heterostructure field-effect transistors using micro-Raman spectroscopy

Applied Physics Letters

Volumn 82, Issue 1, 2003, Pages 124-126

  Kuball, M ^a   Rajasingam, S ^a   Sarua, A ^a   Uren, M J ^b   Martin, T ^b   Hughes, B T ^b   Hilton, K P ^b   Balmer, R S ^b  

^a UNIVERSITY OF BRISTOL   (United Kingdom)

^b QINETIQ   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; FINITE DIFFERENCE METHOD; GALLIUM NITRIDE; HEAT LOSSES; HEAT RESISTANCE; HETEROJUNCTIONS; RAMAN SPECTROSCOPY; SEMICONDUCTING ALUMINUM COMPOUNDS; SILICON CARBIDE; TEMPERATURE DISTRIBUTION; THERMAL CONDUCTIVITY OF SOLIDS;

SINGLE-FINGER DEVICES;

FIELD EFFECT TRANSISTORS;

EID: 0037421410     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.1534935     Document Type: Article

References (16)

1. J. W. Palmour, S. T. Sheppard, R. P. Smith, S. T. Allen, W. L. Pribble, T. J. Smith, Z. Ring, J. J. Sumakeris, A. W. Saxler, and J. W. Milligan, Proceedings of IEEE International Electron Devices Meeting, 2001, paper 17.04.
2. Y. F. Wu, D. Kapolnek, J. P. Ibbetson, P. Parikh, B. P. Keller, and U. K. Mishra, IEEE Trans. Electron Devices 48, 586 (2001).
3. S. Keller, R. Vetury, G. Parish, S. P. DenBaars, and U. K. Mishra, Appl. Phys. Lett. 78, 3088 (2001).
4. G. Simin, X. Hu, N. Ilinskaya, J. Zhang, A. Tarakji, A. Kumar, J. Yang, M. Asif Khan, R. Gaska, and M. S. Shur, IEEE Trans. Electron Devices 22, 53 (2001).
5. L. F. Eastman, V. Tilak, J. Smart, B. M. Green, E. M. Chumbes, R. Dimitrov, H. Kim, O. S. Ambacher, N. Weimann, T. Prunty, M. Murphy, W. J. Schaff, and J. R. Shealy, IEEE Trans. Electron Devices 48, 479 (2001).
6. M. S. Ibrahim, L. R. Paradis, and D. Paterson, IEEE Trans. Compon., Hybrids, Manuf. Technol. 15, 723 (1992).
7. D. I. Florescu, V. M. Asnin, F. H. Pollak, A. M. Jones, J. C. Ramer, M. J. Schurman, and I. Ferguson, Appl. Phys. Lett. 77, 1464 (2000).
8. M. Kuball, J. M. Hayes, M. J. Uren, T. Martin, J. C. H. Birbeck, R. S. Balmer, and B. T. Hughes, IEEE Electron Device Lett. 23, 7 (2002).
9. S. T. Allen, S. T. Sheppard, W. L. Pribble, R. A. Sadler, T. S. Alcorn, Z. Ring, and J. W. Palmour, Mater. Res. Soc. Symp. Proc. 572, 15 (1999).
10. M. Kuball, J. M. Hayes, M. J. Uren, T. Martin, J. C. H. Birbeck, R. S. Balmer, and B. T. Hughes, Mater. Res. Soc. Symp. Proc. 693, I12.4.1 (2001).
11. H. S. Carslaw and J. C. Jaeger, Conduction of Heat in Solids, 2nd ed. (Oxford Clarendon, Oxford, 1959).
12. D. I. Florescu, V. M. Asnin, and F. H. Pollak, Compound Semicond. 7, 62 (2001).
13. C. H. Carter, Jr., V. F. Tsvetkov, R. C. Glass, D. Henshall, M. Brady, St. G. Müller, O. Kordina, K. Irvine, J. A. Edmond, H.-S. Kong, R. Singh, S. T. Allen, and J. W. Palmour, Mater. Sci. Eng., B 61-62, 1 (1999).
14. Landolt-Börnstein, Numerical Data and Functional Relationships in Science and Technology, New Series Vol. 17a (Springer, Berlin, 1982).
15. N. W. Ashcroft and N. D Mermin, Solid State Physics (Saunders, New York, 1976).
16. D. Kotchetkov, J. Zou, A. A. Balandin, D. I. Florescu, and F. H. Pollak, Appl. Phys. Lett. 79, 4316 (2001).