3D nonlinear stress analysis of tin whisker initiation on lead-free components

Journal of Electronic Packaging

Volumn 125, Issue 4, 2003, Pages 621-624

  Lau, John H ^a   Pan, Stephen H ^b  

^a AGILENT TECHNOLOGIES   (United States)

^b Optimal Corporation   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPRESSIVE STRESS; COMPUTER SIMULATION; COPPER; CRACK INITIATION; ELASTOPLASTICITY; FINITE ELEMENT METHOD; PLATING; SOLDERING; STRESS ANALYSIS; TIN;

LEAD FREE SOLDERING; THREE DIMENSIONAL NONLINEAR STRESS ANALYSIS; TIN WHISKER INITIATION;

CRYSTAL WHISKERS;

EID: 0346306382     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1604805     Document Type: Article

References (18)

1. Lau, J. H., 2000, Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies, McGraw-Hill, New York.
2. Lau, J. H., Wong, C. P., Lee, N. C., and Lee, R., 2002, Electronics Manufacturing With Lead-Free, Halogen-Free, and Conductive Adhesive Materials, McGraw-Hill, New York.
3. Xu, Chen, Zhang, Y., Fan, C., and Abys, J., 2002, "Understand Whisker Phenomenon: The Driving Force for Whisker Formation," www.circuitree.com, pp. 94-104.
4. Choi, W., Lee, T., Tu, K., Tamura, N., Celestre, R., MacDowell, A., Bong, Y., Nguyen, L., and Sheng, G., 2002, "Structure and Kinetics of Sn Whisker Growth on Pb-free Solder Finish," Proceedings of Electronic Components and Technology Conference, pp. 628-633.
5. Kawanaka, R., Fujiwara, K., Nango, S., and Hasegawa, T., "Influence of Impurities on the Growth on Tin Whiskers," Jpn. J. Appl. Phys., Part 1, 22, pp. 917-921.
6. Endo, M., Higuchi, S., Tokuda, Y., and Sakabe, Y., "Elimination of Whisker Growth on Tin Plated Electrodes," Proceedings of International Symposium for Testing and Failure Analysis, pp. 305-311.
7. Harris, P., 1994, "The Growth of Tin Whiskers," International Tin Research Institute, Report No. 734.
8. Lee, B. Z., and Lee, D. N., 1998, "Spontaneous Growth Mechanism of Tin Whiskers," Acta Mater., 46, pp. 3701-3714.
9. Tu, K. N., 1994, "Irreversible Processed of Spontaneous Whisker Growth in Bimetallic Cu-Sn Thin-Film Reactions," Phys. Rev. B, 49, pp. 2030-2034.
10. Chang, C. Y., and Vook, R. W., 1993, "The Effect of Surface Aluminum Oxide Films on Thermally Induced Hillock Formation," Thin Solid Films, 228, pp. 205-302.
11. Brusse, J., Ewell, G., and Siplon, J., 2002, "Tin Whiskers: Attributes and Mitigation," Proceedings of Capacitor and Resistor Technology Symposium, pp. 68-80.
12. Brusse, J., 2002, "Tin Whisker Observations on Pure Tin-Plated Ceramic Chip Capacitors," Proceedings of AESF-SUF/FIN Conference, pp. 45-61.
13. Schetty, R., 2002, "Tin Whisker Study - Experimentation and Mechanistic Understanding," Proceedings of AESF-SUF/FIN Conference, pp. 7-17.
14. Tin Whiskers: Lead-Free, Whiskerless Tin, 2002, http://rf.rfglobalnet.com/library/applicationNotes/files/5/whiskers/htm Eliminating.
15. Van Westerhuyzen, D., Backes, P., Linder, J., Merrell, S., and Poeschel, R., 1992, "Tin Whisker Induced Failure in Vacuum," Proceedings of International Symposium for Testing and Failure Analysis, pp. 407-412.
16. Lin, M. C., 1984, "Tin Whisker Growth on IC Lead Finish - A Review," AT&T Bell Laboratories Technical Memorandum: TM52221-840709-01.
17. King, J. A., 1988, Material Handbook for Hybrid Microelectronics, Artech House.
18. Lau, J. H., and Pao, Y. H., 1997, Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies, McGraw-Hill, New York.