The role of special boundaries during solidification and microstructure evolution in lead free solder joints

Materials Science Forum

Volumn 495-497, Issue PART 2, 2005, Pages 1419-1424

  Telang, Adwait U ^a   Bieler, Thomas R ^a  

^a Michigan State University   (United States)

Author keywords

Creep; Damage nucleation; Grain boundary sliding; Lead free solder; Special boundaries; Thermomechanical fatigue

Indexed keywords

GRAIN BOUNDARY SLIDING; MICROSTRUCTURE; NUCLEATION; SOLIDIFICATION; THERMAL CYCLING;

DAMAGE NUCLEATION; LEAD-FREE SOLDER; SPECIAL BOUNDARIES;

SOLDERED JOINTS;

EID: 33645968151     PISSN: 02555476     EISSN: 16629752     Source Type: Book Series    
DOI: 10.4028/0-87849-975-x.1419     Document Type: Conference Paper

References (18)

1. J.Glazer, J. Electron Mater., Vol 23(8) (1994), p. 693-700.
2. S.K.Kang and A.K.Sarkhel, J. Electron Mater., Vol 23 (1994), p. 701-707.
3. S.Jin, JOM, Vol 45(7) (1993), p. 13.
4. M.McCormack and S.Jin, JOM, Vol 45(7) (1993), p. 36-40.
5. S.Choi, J.G.Lee, K.N.Subramanian, J.P.Lucas and T.R.Bieler, J. Electron Mater., Vol 31(4) (2002), p. 292.
6. M.F.Ashby and R.A.Verrall, Acta Metallurgica, Vol 21(2) (1973), p. 1973.
7. J.A.Rayne and B.S.Chandrasekhar, Phys. Rev., Vol 120 (1960), p. 1658-1663.
8. B.Chalmers, Proceedings of the Royal Society of London, Series A, Mathematical and Physical Sciences, Vol 156/888 (1936), p. 427-443.
9. D. Frear, H. Morgan, The mechanics of Solder Alloy interconnects, ed. J.H. Lau, 1994.
10. B.Duzgun, A.E.Ekinci, I.Karaman and N.Ucar, J. of Mech. Behavior of Materials, Vol 10(3) (1999), p. 187-203.
11. M.Fujiwara and T.Hirokawa, J. Japan Inst. Metals, Vol 51(9) (1987), p. 830-838
12. D.W.Henderson, J.J.Woods, T.A.Gosselin, J.Bartelo, D.E.King, T.M.Korhonen, M.A.Korhonen, L.P.Lehman, E.J.Cotts, S.K.Kang, P.A.Lauro, D.Y.Shih, C.Goldsmith and K.J.Puttlitz, J. Mater. Res., Vol 19(6) (2004), p. 1608-1612.
13. A.U.Telang, T.R.Bieler, S.Choi and K.N.Subramanian, J. Mater. Res., Vol 17(9) (2002), p. 2294-2306.
14. A.U.Telang, T.R.Bieler, M.A.Crimp and K.N.Subramanian, Material Science and Engineering A, submitted (2004).
15. A.U.Telang, T.R.Bieler, J.P.Lucas, K.N.Subramanian, L.P.Lehman, Y. Y. and E.Cotts, J. of Electron. Mater., Vol 33(12), (Dec. 2004), in press.
16. A.U.Telang and T.R.Bieler, Scripta Materialia, submitted (2004).
17. A.U.Telang, T.R.Bieler, D.E.Mason and K.N.Subramanian, J. Electron Mater., Vol 32/12 (2003), p. 1455-1462.
18. L.P.Lehman, S.N.Athavale, T.Z.Fullem, A.C.Giamis, R.K.Kinyanjui, M.Lowenstein, K.Mather, R.Patel, D.Rae, J.Wang, Y.Xing, L.Zavalij, P.Borgesen and E.J.Cotts, J. of Electron. Mater., Vol 33(12), (2004) in press.