Effect of Ti interlayer on the residual stress and texture development of TiN thin films

Surface and Coatings Technology

Volumn 200, Issue 20-21, 2006, Pages 5937-5945

  Huang, Jia Hong ^a   Ma, Cheng Hsin ^b   Chen, Haydn ^b,c,d  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

^b University of Illinois at Urbana Champaign   (United States)

^c TUNGHAI UNIVERSITY   (Taiwan)

^d CITY UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

Residual stress; Texture; Ti interlayer; Titanium nitride

Indexed keywords

FILM GROWTH; ION BEAM ASSISTED DEPOSITION; RESIDUAL STRESSES; SUBSTRATES; TEXTURES; THIN FILMS; X RAY DIFFRACTION ANALYSIS;

GRAIN ORIENTATION; IN-PLANE TEXTURE; TITANIUM INTERLAYER;

TITANIUM NITRIDE;

FILM GROWTH; ION BEAM ASSISTED DEPOSITION; RESIDUAL STRESSES; SUBSTRATES; TEXTURES; THIN FILMS; TITANIUM NITRIDE; X RAY DIFFRACTION ANALYSIS;

EID: 33645816809     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.surfcoat.2005.09.005     Document Type: Article

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