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Volumn 140, Issue 3, 2001, Pages 206-214
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Deposition of TiN thin films on Si(100) by HCD ion plating
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Author keywords
HCD ion plating; Packing factor; Preferred orientation; Resistivity; TiN
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Indexed keywords
ATOMIC FORCE MICROSCOPY;
DEPOSITION;
ELECTRIC CONDUCTIVITY;
FILMS;
PLATING;
RUTHERFORD BACKSCATTERING SPECTROSCOPY;
SCANNING ELECTRON MICROSCOPY;
SILICON;
SUBSTRATES;
TITANIUM NITRIDE;
TRANSMISSION ELECTRON MICROSCOPY;
X RAY DIFFRACTION ANALYSIS;
X RAY PHOTOELECTRON SPECTROSCOPY;
HOLLOW CATHODE DISCHARGE ION PLATING;
NANOINDENTATION TESTS;
CERAMIC COATINGS;
COATING;
INDUSTRIAL APPLICATION;
ION PLATING;
TITANIUM NITRIDE;
WEAR RESISTANCE;
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EID: 0035978380
PISSN: 02578972
EISSN: None
Source Type: Journal
DOI: 10.1016/S0257-8972(01)01120-3 Document Type: Article |
Times cited : (91)
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References (22)
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