Determination of thermal expansion coefficient of thermal oxide

Sensors and Materials

Volumn 17, Issue 8, 2005, Pages 441-451

  Tsou, Chingfu ^a   Huang, Yu Sheng ^a   Li, Hung Chung ^a   Lai, Teng Hsien ^a  

^a FENG CHIA UNIVERSITY   (Taiwan)

Author keywords

Buckling deformation; Finite element analysis; Microbridge; Thermal expansion coefficient; Thermal oxide film

Indexed keywords

EID: 33645508310     PISSN: 09144935     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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