Effect of stress control layer (SCL) on via-stability in organic low-k/Cu dual damascene interconnects under thermal cycle stress

Proceedings of the IEEE 2003 International Interconnect Technology Conference, IITC 2003

Volumn , Issue , 2003, Pages 213-215

  Tagami, M ^a   Ohtake, H ^a   Hayashi, Y ^a   Miyamoto, H ^b  

^a NEC CORPORATION   (Japan)

^b RENESAS TECHNOLOGY CORP   (Japan)

Author keywords

Dielectric films; Dielectric materials; National electric code; Organic materials; Stress control; Tensile stress; Testing; Thermal resistance; Thermal stability; Thermal stresses

Indexed keywords

COPPER; DIELECTRIC FILMS; ELASTIC MODULI; FILMS; HEAT RESISTANCE; INTEGRATED CIRCUIT INTERCONNECTS; MATERIALS TESTING; STABILITY; TENSILE STRESS; TENSILE TESTING; TESTING; THERMAL CYCLING; THERMAL EXPANSION; THERMAL STRESS; THERMODYNAMIC STABILITY;

DUAL DAMASCENE INTERCONNECT; DUAL DAMASCENE INTERCONNECTS; EFFECT OF STRESS; INTER-LAYER DIELECTRICS; NATIONAL ELECTRIC CODE; ORGANIC MATERIALS; STRESS CONTROL; STRESS VOIDING;

DIELECTRIC MATERIALS;

EID: 84944053784     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IITC.2003.1219757     Document Type: Conference Paper

References (6)

1. M. -S. Yeh et al., Proc. of ADMET, (2002)
2. K. Motoyama et al., Proc. of. IITC, pp268, (2002)
3. E. P. Barth et al., Proc. of IITC, pp219, (2000)
4. T. Ohshima et al., Proc. of IEDM, pp123, (2000)
5. S. M. Jang et al., Proc. of VLSI Symp., pp18, (2001)
6. K. Kinoshita et al., Proc. of IEDM, pp257, (2000)