Microstructural characterization and phase development at the interface between aluminum nitride and titanium after annealing at 1300°-1500°C

Journal of the American Ceramic Society

Volumn 89, Issue 4, 2006, Pages 1409-1418

  Chiu, Chia Hsiang ^a   Lin, Chien Cheng ^a,b  

^a NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

^b AMERICAN CERAMIC SOCIETY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ARGON ATMOSPHERE; INTERFACIAL REACTION; MICROSTRUCTURAL CHARACTERIZATION;

ANNEALING; ARGON; CRYSTAL STRUCTURE; INTERFACES (MATERIALS); MICROSTRUCTURE; MORPHOLOGY; SCANNING ELECTRON MICROSCOPY; TITANIUM;

ALUMINUM NITRIDE;

EID: 33645166436     PISSN: 00027820     EISSN: 15512916     Source Type: Journal    
DOI: 10.1111/j.1551-2916.2005.00880.x     Document Type: Article

References (40)

1. C. A. Slack, "Nonmetallic Crystals with High Thermal Conductivity," J. Phys. Chem. Solids, 34, 321-35 (1973).
2. N. Iwase, K. Anzai, and K. Shinozaki, "Aluminum Nitride Substrates Having High Thermal Conductivity," Toshiba Rev., 153, 49-53 (1985).
3. P. Martineau, R. Pailler, M. Lahaye, and R. Naslain, "SiC Filament/Titanium Matrix Composites Regarded as Model Composites. II - Fiber/Matrix Chemical Interactions at High Temperatures," J. Mater. Sci., 19, 2749-70 (1984).
4. J. C. Feng, M. Naka, and J. C. Schuster, "Reaction Mechanism Between SiC Ceramic and Titanium Foil in Solid Slate Bonding," J. Jpn. Inst. Metals, 59, 978-83 (1995).
5. W. J. Whatley and F. E. Wawner, "Kinetics of the Reaction Between SiC (SCS-6) Filaments and Titanium (6Al-4V) Matrix," J. Mater. Sci. Lett., 4 [2] 173-5 (1985).
6. 3-Titanium Adhesion in the View of the Diffusion Bonding Process," J. Mater. Sci., 37, 4385-90 (2002).
7. R. Yue, Y. wang, C. Chen, and C. Xu, "Interface Reaction of Ti and Mullite Ceramic Substrate," Appl. Surf. Sci., 126, 255-64 (1998).
8. E. Faran, I. Gotman, and E. Y. Gutmanas, "Experimental Study of the Reaction Zone at Boron Nitride Ceramic-Ti Metal Interface," Mater. Sci. Eng., A288, 66-74 (2000).
9. 2ZrO Phases Formed in the Titanium and Zirconia Interface after Reaction at 1550°C," J. Am. Ceram. Soc., 88 [5] 1268-72 (2005).
10. P. A. Janeway, "Making the Grade in Demanding Electronic Application," Ceram. Ind., 137, 28-32 (1991).
11. J. A. Chediak, "Ceramic Engineers in the 21st Century," Am. Ceram. Soc. Bull., 75 [1] 52-5 (1996).
12. T. B. Jackson, A. V. Virkar, K. L. More, R. B. Dinwiddie, and R. A. Cutler, "High-Thermal-Conductivity Aluminum Nitride Ceramics: The Effect of Thermodynamic, Kinetic and Microstructural Factors," J. Am. Ceram. Soc., 80 [6] 1421-35 (1997).
13. S. Nakahata, K. Sogabe, T. Matsuura, and A. Yamakawa, "One Role of Titanium Compound Particles in Aluminum Nitride Sintered Body," J. Mater. Sci., 32, 1873-6 (1997).
14. H. D. Lee, "Phase Chemistry, Thermodynamic and Kinetic Characterization of Interfacial Reaction Between Aluminum Nitride and Titanium"; Ph.D. Dissertation, Arizona Stale University, Tempe, AZ, 1993.
15. A. D. Westwood and M. R. Notis, "Analytical Electron Microscopy Study of AlN Substrates and Metallization Interfaces," Adv. Ceram., 26, 171-87 (1989).
16. A. D. Westwood and M. R. Notis, "An Issue in Thermal Management: Metallizing High Thermal Conductivity Ceramic Substrates in Microelectronics, " J. Miner. Mat. Mater. Soc., 43 [6] 10-5 (1991).
17. X. He, K. Tao, and Y. Fan, "Solid-State Reaction of Ti and Ni Thin with Aluminum Nitride," J. Vac. Sci. Technol., 14 [4] 2564-9 (1996).
18. T. Yasumoto, K. Amakawa, N. Iwase, and N. Shinsawa, "Reaction Between AlN and Metal Thin Films During High Temperature Annealing," J. Ceram. Soc. Jpn., 101 [9] 969-73 (1993).
19. Y. Imanaka and M. R. Notis, "Interfacial Reaction Between Titanium Thin Films and Aluminum Nitride Substrates," J. Am. Ceram. Soc., 82 [6] 1547-52 (1999).
20. A. H. Carim and R. E. Loehman, "Microstructure at the Interface Between AlN and a Ag-Cu-Ti Braze Alloy," J. Mater. Res., 5 [7] 1520-9 (1990).
21. R. E. Loehman, "Interfacial Reactions in Ceramic-Metal Systems," Ceram. Bull., 68 [4] 891-6 (1989).
22. 3," Acta Metall. Mater., 40 (Suppl.) S75-83 (1992).
23. X. He, S. Z. Yang, K. Tao, and Y. Fan, "Investigation of the Interface Reactions of Ti Thin Films with AlN Substrate," J. Muter. Res., 12 [3] 846-51 (1997).
24. M. Pinkas, N. Frage, N. Froumin, J. Pelleg, and M. P. Dariel, "Early Stages of Interface Reactions Between AlN and Ti Thin Films," J. Vac. Sci. Technol., 20 [3] 887-96 (2002).
25. M. H. El-Sayed, M. Naka, and J. C. Schuster, "Interfacial Structure and Reaction Mechanism of AlN/Ti Joints," J. Mater. Sci., 32, 2715-21 (1997).
26. Y. Paransky, A. Berner, and I. Gotman, "Microstructure of Reaction Zone at the Ti-AlN Interface," Mater. Lett., 40, 180-6 (1990).
27. Y. Paransky, I. Gotman, and E. Y. Gutmanas, "Reactive Phase Formation at AlN-Ti and AlN-TiAl Interfaces," Mater. Sci. Eng., A277, 83-94 (2000).
28. Y. M. Paransky, A. I. Berner, I. Y. Gotman, and E. Y. Gutmanas, "Phase Recognition in AlN-Ti System by Energy Dispersive Spectroseopy and Electron Backscatter Diffraction," Mikrochim. Acta, 134, 171-7 (2000).
29. K. L. Lin and C. C. Lin, "Zirconia-Related Phases in the Zirconia Titanium Diffusion Couple after Annealing at 1000°C-1550°C," J. Am. Ceram. Soc., 88 [10] 2928-34 (2005).
30. J. C. Schuster and J. Bauer, "The Ternary System Titanium-Aluminum-Nitrogen," J. Solid State Chem., 53 [2] 260-5 (1984).
31. M. A. Pietzka and J. C. Schuster, "Phase Equilibria in the Quaternary System Ti-Al-C-N," J. Am. Ceram. Soc., 79 [9] 2321-30 (1996).
32. 3Al-Nb Alloy," Scripta Metall. Mater., 24 [7] 1319-22 (1990).
33. 3Al-Nb Alloy," Mater. Sci. Eng., A269, 197-204 (1999).
34. B. D. Cullity, Elements of X-Ray Diffraction. Addison-Wesley Publishing Company Inc., California, USA, 1978.
35. J. L. Murray, Phase Diagrams of Binary Titanium Alloys. ASM International, Metals Part, Ohio, USA, 1987.
36. J. Raisanen, A. Anttila, and J. Keinonen, "Diffusion of Aluminum in Ion-Implanted α-Ti," J. Appl. Phys., 57 [2] 613-4 (1985).
37. A. Anttila, J. Raisanen, and J. Keinonen, "Diffusion of Nitrogen in a-Ti," Appl. Phys. Lett., 42 [6] 498-500 (1983).
38. J. C. Viala, N. Peillon, L. Clochefert, and J. Bouix, "Diffusion Paths and Reaction Mechanisms in the High-Temperature Chemical Interaction Between Carbon and Titanium Aluminides," Mater. Sci. Eng., A203, 222-37 (1995).
39. I. Barin, Thermochemical Data of Pure Substances. VCH, Weinheim, Germany, 1993.
40. L. Hultman, "Thermal Stability of Nitride Thin Films," Vacuum, 57, 1-30 (2000).