Interfacial reaction between titanium thin films and aluminum nitride substrates

Journal of the American Ceramic Society

Volumn 82, Issue 6, 1999, Pages 1547-1552

  Imanaka, Yoshihiko ^a   Notis, Michael R ^b  

^a FUJITSU LABORATORIES LTD   (Japan)

^b Lehigh University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVATION ENERGY; ALUMINUM COMPOUNDS; INTERDIFFUSION (SOLIDS); INTERFACIAL ENERGY; NITROGEN; RUTHERFORD BACKSCATTERING SPECTROSCOPY; TEMPERATURE; TITANIUM; TRANSMISSION ELECTRON MICROSCOPY;

ALUMINUM NITRIDE; ELECTRON MICROPROBE ANALYSIS; INTERFACIAL REACTION;

INTERFACES (MATERIALS);

EID: 0032661770     PISSN: 00027820     EISSN: None     Source Type: Journal    
DOI: 10.1111/j.1151-2916.1999.tb01953.x     Document Type: Article

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