Hot embossing of micro-featured devices

Annual Technical Conference - ANTEC, Conference Proceedings

Volumn 2, Issue , 2005, Pages 260-264

  Chen, S C ^a   Lin, M C ^a   Chien, R D ^b   Liaw, W L ^b  

^a CHUNG YUAN CHRISTIAN UNIVERSITY   (Taiwan)

^b NANYA INSTITUTE OF TECHNOLOGY   (Taiwan)

Author keywords

Applied force; Embossing temperature; Hot embossing; Micro featured; Photoresist; Stamp

Indexed keywords

COST EFFECTIVENESS; GLASS; PHOTORESISTORS; POLYMERS; SILICON; STAMPING;

APPLIED FORCE; EMBOSSING TEMPERATURE; HOT EMBOSSING; MICRO-FEATURED; PHOTORESIST; STAMP;

MICROELECTROMECHANICAL DEVICES;

EID: 33644933319     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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