Electrochemical characterization of copper chemical mechanical planarization in KIO 3 slurry

Applied Surface Science

Volumn 229, Issue 1-4, 2004, Pages 167-174

  Du, Tianbao ^a   Tamboli, Dnyanesh ^a   Luo, Ying ^a   Desai, Vimal ^a  

^a UNIVERSITY OF CENTRAL FLORIDA   (United States)

Author keywords

CMP; Electrochemistry; Oxidation; Passivation; Polishing

Indexed keywords

ALUMINA; ATOMIC FORCE MICROSCOPY; CHEMICAL MECHANICAL POLISHING; ELECTROCHEMISTRY; ETCHING; METALLIZING; MORPHOLOGY; PH EFFECTS; POTASSIUM COMPOUNDS; PRECIPITATION (CHEMICAL); SLURRIES; SURFACE ROUGHNESS; X RAY PHOTOELECTRON SPECTROSCOPY;

CORROSION SUSCEPTIBILITY; SURFACE PASSIVATION;

COPPER;

EID: 2342561100     PISSN: 01694332     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.apsusc.2004.01.062     Document Type: Article

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