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Volumn 812, Issue , 2004, Pages
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Materials, Technology and Reliability for Advanced Interconnects and Low-k Dielectrics - 2004
[No Author Info available]
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Author keywords
[No Author keywords available]
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Indexed keywords
ATOMIC FORCE MICROSCOPY;
CAPACITANCE;
CHEMICAL BONDS;
CHEMICAL VAPOR DEPOSITION;
ELECTRIC POTENTIAL;
FOURIER TRANSFORM INFRARED SPECTROSCOPY;
LEAKAGE CURRENTS;
MORPHOLOGY;
OPTIMIZATION;
PERMITTIVITY;
PHOTORESISTS;
POLYMERS;
POROSITY;
POROUS MATERIALS;
SEMICONDUCTOR MATERIALS;
THIN FILMS;
BREAKDOWN FIELDS;
CHEMICAL-MECHANICAL PLANARIZATION (CMP);
EIREV;
ENERGY FILTERING TEM (EFTEM) ANALYSIS;
METAL INSULATOR SEMICONDUCTORS (MIS);
METAL-INSULATOR-METAL (MIM) STRUCTURES;
MOLECULAR CAULKING TECHNOLOGY;
OCTADECYLTRICHLOROSILANE (OTS);
POROUS METHYLSILESQUIOXANE (P-MSQ);
VINYLTRIMETHOXYSILANE (VTMS);
DIELECTRIC MATERIALS;
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EID: 12844249999
PISSN: 02729172
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Review |
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Times cited : (4)
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References (0)
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