Atomic force microscopy study of the role of molecular weight of poly(acrylic acid) in chemical mechanical planarization for shallow trench isolation

Journal of Materials Research

Volumn 21, Issue 2, 2006, Pages 473-479

  Cho, Chae Woong ^a   Kim, Sang Kyun ^a   Paik, Ungyu ^a   Park, Jea Gun ^a   Sigmund, Wolfgang M ^b  

^a Hanyang University   (South Korea)

^b J Crayton Pruitt Family Department of Biomedical Engineering   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ATOMIC FORCE MICROSCOPY; FILMS; FORCE MEASUREMENT; MOLECULAR WEIGHT; NITRIDES; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; SILICON COMPOUNDS;

CHEMICAL MECHANICAL PLANARIZATION (CMP); POLYACRYLIC ACID; TETRAETHYLORTHOSILICATE;

POLYACRYLATES;

EID: 33644513988     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/jmr.2006.0054     Document Type: Article

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