Photoresist chemical mechanical polishing for shallow trench isolation

Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers

Volumn 37, Issue 4 SUPPL. A, 1998, Pages 1697-1700

  Itoh, Akio ^a   Imai, Masahiko ^a   Arimoto, Yoshihiro ^a  

^a FUJITSU LABORATORIES LTD   (Japan)

Author keywords

Baking temperature; Chemical mechanical polishing (CMP); Dummy pattern; Photoresist; Polishing rate; Shallow trench isolation (STI)

Indexed keywords

CHEMICAL POLISHING; THERMAL EFFECTS;

CHEMICAL MECHANICAL POLISHING (CMP); SHALLOR TRENCH ISOLATION (STI);

PHOTORESISTS;

EID: 0032045677     PISSN: 00214922     EISSN: None     Source Type: Journal    
DOI: 10.1143/jjap.37.1697     Document Type: Article

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