Study on mechanically induced current suppression and super filling mechanisms

Electrochemical and Solid-State Letters

Volumn 9, Issue 4, 2006, Pages

  Başol, Bülent M ^a,c   West, Alan C ^b,c  

^a ASM NuTool Inc   (United States)

^b Department of Earth and Environmental Sciences   (United States)

^c ELECTROCHEMICAL SOCIETY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BLANKET WAFER SURFACES; ELECTROCHEMICAL MECHANICAL DEPOSITION; ORGANIC SUPPRESSORS; SUPER FILLING MECHANISMS;

ADDITIVES; COPPER; CURRENT DENSITY; ELECTROCHEMISTRY; ELECTROPLATING; SURFACE CHEMISTRY;

DEPOSITION;

EID: 33244485458     PISSN: 10990062     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.2173191     Document Type: Article

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