Intermetallic compounds formed at the interface between liquid indium and copper substrates

Journal of Electronic Materials

Volumn 31, Issue 5, 2002, Pages 488-493

  Yu, C L ^a   Wang, S S ^a   Chuang, T H ^a  

^a NATIONAL TAIWAN UNIVERSITY   (Taiwan)

Author keywords

Cu In interface; Intermetallic compound; Soldering reaction

Indexed keywords

ACTIVATION ENERGY; BONDING; COPPER COMPOUNDS; DIFFUSION; INDIUM COMPOUNDS; INTERFACES (MATERIALS); RATE CONSTANTS; SOLDERING; SPUTTER DEPOSITION; SURFACE REACTIONS; THERMAL EFFECTS;

RECYCLED SPUTTERING TARGETS; SOLDERING REACTIONS;

INTERMETALLICS;

EID: 0036575619     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-002-0104-9     Document Type: Article

References (9)