Interface microstructure and mechanical fatigue behavior of Sn63Pb37 on electroplated Cu and Ni

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2000, Pages 138-141

  Zhang, Charles ^a   Shang, Jian Ku ^a   Liu, Pilin ^a  

^a MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; CRACK PROPAGATION; DEFECTS; ELECTROPLATING; FATIGUE OF MATERIALS; INTERFACES (MATERIALS); METALLOGRAPHIC MICROSTRUCTURE; MICROSCOPIC EXAMINATION; NICKEL; SOLDERED JOINTS; SOLDERING; TIN ALLOYS;

FLIP CHIP BUMPING; FLIP CHIP INTERCONNECT TECHNOLOGY; INTERFACE MICROSTRUCTURE; UNDER BUMP METALLURGY; ZIGZAG INTERFACE;

FLIP CHIP DEVICES;

EID: 0034476169     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)