Interfacial microstructure and intermetallics developed in the interface between in solders and Au/Ni/Ti thin films during reflow process

Journal of Electronic Materials

Volumn 32, Issue 6, 2003, Pages 483-491

  Shin, Keesam ^a   Cho, Won Gu ^b   Kim, Young Ho ^b  

^a Changwon National University   (South Korea)

^b Hanyang University   (South Korea)

Author keywords

CsCl type InNi; In solder; Intermetallic compounds; In27Ni10

Indexed keywords

COMPUTER SIMULATION; FLIP CHIP DEVICES; INTERFACES (MATERIALS); INTERFACIAL ENERGY; INTERMETALLICS; MICROSTRUCTURE; RAPID THERMAL ANNEALING; SCANNING ELECTRON MICROSCOPY; SEMICONDUCTING INDIUM; SOLDERING; TRANSMISSION ELECTRON MICROSCOPY; X RAY DIFFRACTION ANALYSIS;

CONVERGENT BEAM ELECTRON DIFFRACTION; FIELD-EMISSION SCANNING ELECTRON MICROSCOPY; FLIP-CHIP SOLDER-JOINING PROCESS; REFLOW PROCESS;

THIN FILMS;

EID: 0037485104     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-003-0130-2     Document Type: Article

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