Joining of silicon nitride with a titanium foil interlayer

Materials Science and Engineering: A

Volumn 352, Issue 1-2, 2003, Pages 169-178

  Lemus, Jose ^a   Drew, Robin A L ^a  

^a MCGILL UNIVERSITY   (Canada)

Author keywords

Bend strength; Diffusion bonding; Silicon nitride; Titanium

Indexed keywords

BONDING; DIFFUSION; HOT PRESSING; METAL FOIL; SCANNING ELECTRON MICROSCOPY; TITANIUM; X RAY DIFFRACTION ANALYSIS;

TITANIUM FOILS;

SILICON NITRIDE;

SILICON NITRIDE; TITANIUM;

EID: 0037644709     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/s0921-5093(02)00892-4     Document Type: Article

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