Joining of silicon nitride via a transient liquid

Scripta Materialia

Volumn 36, Issue 10, 1997, Pages 1167-1173

  Paulasto, M ^a   Ceccone, G ^a   Peteves, S D ^a  

^a JOINT RESEARCH CENTRE   (Italy)

Author keywords

[No Author keywords available]

Indexed keywords

BENDING STRENGTH; BONDING; DIFFUSION; HEAT TREATMENT; INTERFACES (MATERIALS); LIQUID METALS; MELTING; MICROSTRUCTURE; SCANNING ELECTRON MICROSCOPY; SURFACES;

HOMOGENIZATION; METAL INTERLAYER; PARTIAL TRANSIENT LIQUID PHASE;

SILICON NITRIDE;

EID: 0031130565     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1359-6462(97)00007-9     Document Type: Article

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