Joint strength and interfacial microstructure in silicon nitride/nickel-based Inconel 718 alloy bonding

Journal of Materials Science

Volumn 32, Issue 1, 1997, Pages 221-228

  Lee, Woo Chun ^a  

^a Korea Research Institute of Standards and Science   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

BENDING STRENGTH; BONDING; DEGRADATION; DIFFUSION IN SOLIDS; FILLER METALS; JOINTS (STRUCTURAL COMPONENTS); METALLOGRAPHIC MICROSTRUCTURE; NICKEL ALLOYS; SHEAR STRENGTH; SILICON NITRIDE; THERMAL EFFECTS;

NICKLE ALLOY INCONEL 718;

INTERFACES (MATERIALS);

EID: 0030787194     PISSN: 00222461     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1018564208018     Document Type: Article

References (10)

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