Kinetics of copper CVD using solution delivery of Cu (hfac) 2 and isopropanol

Journal of the Electrochemical Society

Volumn 153, Issue 3, 2006, Pages

  Wang, Lidong ^a,b   Griffin, Gregory L ^a,b  

^a LOUISIANA STATE UNIVERSITY   (United States)

^b ELECTROCHEMICAL SOCIETY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CLUSTER FORMATION; KINETIC BEHAVIOR; PARAMETER SERIES; REACTION MECHANISM;

ALCOHOLS; COPPER; GROWTH (MATERIALS); PARTIAL PRESSURE; PROPANE; REACTION KINETICS;

CHEMICAL VAPOR DEPOSITION;

EID: 32044473476     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.2158575     Document Type: Article

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