Additive patterning of conductors and superconductors by solution stamping nanolithography

Small

Volumn 2, Issue 1, 2006, Pages 75-79

  Chang, Nolanne A ^a   Richardson, Jacob J ^a   Clem, Paul G ^a   Hsu, Julia W P ^a  

^a SANDIA NATIONAL LABORATORIES   (United States)

Author keywords

Copper; Oxides; Printing; Soft lithography; Superconductors

Indexed keywords

COPPER; ELASTOMERS; ETCHING; INK; NANOTECHNOLOGY; OXIDES; PRINTING; STAMPING;

ADAPTIVE PATTERNING; INORGANIC MATERIALS; SOFT LITHOGRAPHY; SOLUTION STAMPING NANOLITHOGRAPHY (SSNL);

SUPERCONDUCTING MATERIALS;

COPPER; ELASTOMERS; ETCHING; INK; OXIDES; PRINTING; STAMPING;

COPPER; DIMETICONE; NANOMATERIAL;

ARTICLE; CHEMISTRY; CONFORMATION; CRYSTALLIZATION; ELECTRIC CONDUCTIVITY; ELECTROCHEMISTRY; MATERIALS TESTING; METHODOLOGY; NANOTECHNOLOGY; PARTICLE SIZE; SOLUTION AND SOLUBILITY; SURFACE PROPERTY; ULTRASTRUCTURE;

COPPER; CRYSTALLIZATION; DIMETHYLPOLYSILOXANES; ELECTRIC CONDUCTIVITY; ELECTROCHEMISTRY; MATERIALS TESTING; MOLECULAR CONFORMATION; NANOSTRUCTURES; NANOTECHNOLOGY; PARTICLE SIZE; SOLUTIONS; SURFACE PROPERTIES;

EID: 32044461091     PISSN: 16136810     EISSN: 16136829     Source Type: Journal    
DOI: 10.1002/smll.200500264     Document Type: Article

References (18)

1. A. Sheth, H. Schmidt, V. Lasrado, Appl. Supercond. 1998, 6, 855.
2. a) R. Schwanz, Chem. Mater. 1997, 9, 2325;
3. b) F. F. Lange, Science 1996, 273, 903.
4. a) E. Kim, Y. Xia, G. M. Whitesides, J. Am. Chem. Soc. 1996, 118, 5722;
5. b) C. R. Martin, I.A. Aksay, J. Phys. Chem. B 2003, 107, 4261.
6. a) X.-M. Zhao, Y. Xia, G. Whitesides, Adv. Mater. 1996, 8, 837;
7. b) J. H. Kim, F. F. Lange, C.-I. Cheon, J. Mater. Res. 1999, 14, 1194.
8. a) P. G. Clem, N. L Jeon, R. G. Nuzzo, D. A. Payne, J. Am. Ceram. Soc. 1997, 80, 2821;
9. b) N. L. Jeon, P. Clem, D.Y. Jung, W. Lin, G. S. Girolami, D. A. Payne, R. G. Nuzzo, Adv. Mater. 1997, 9, 891;
10. N. L. Jeon, P. G. Clem, R. G. Nuzzo, D. A. Payne, J. Mater. Res. 1995, 10, 2996.
11. a) M. Su, X. Liu, S.-Y. Li, V. P. Dravid, C. A. Mirkin, J. Am. Chem. Soc. 2002, 124, 1560;
12. b) L. Fu, X. Liu, Y. Zhang, V. P. Dravid, C. A. Mirkin, Nano Lett. 2003, 3, 757.
13. M. P. Siegal, J.T. Dawley, P. G. Clem, D. L Overmyer, Physica C 2003, 399, 143.
14. C. Kittel, Introduction to Solid State Physics, 7th ed., John Wiley&Sons, New York, 1996, p. 160.
15. K. Felmet, Y.-L. Loo, Y. Sun, Appl. Phys. Lett. 2004, 85, 3316.
16. H.-L. Zhang, D. G. Bucknall, A. Dupius, Nano Lett. 2004, 4, 1513.
17. N. Amemiya, S. Kasai, K. Yoda, Z. N. Jiang, G. A. Levin, P.M. Barnes, C.E Oberly, Supercond. Sci. Technol. 2004, 17, 1464.
18. T.W. Odom, C. Love, D. B. Wolfe, K. E. Paul, G. M. Whitesides, Langmuir 2002, 18, 5314.