Impact of bath composition on the purity and room temperature anneal characteristics of thin copper film

Proceedings - Electrochemical Society

Volumn PV 2004-17, Issue , 2004, Pages 96-107

  Sukamto, J H ^a   Reid, J D ^a  

^a Novellus Systems Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEAL RATES; BATH COMPOSITION; DEFECT DENSITY;

COPPER; ELECTROMIGRATION; ELECTROPLATING; GRAIN BOUNDARIES; INTEGRATED CIRCUITS; PHASE COMPOSITION; RAPID THERMAL ANNEALING; SOLID ELECTROLYTES;

THIN FILMS;

EID: 31744431970     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)

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