Study of electron-scattering mechanism in nanoscale Cu interconnects

Journal of Electronic Materials

Volumn 32, Issue 10, 2003, Pages 982-987

  Kim, Choong Un ^a   Park, Jaeyong ^a   Michael, Nancy ^a   Gillespie, Paul ^a,c   Augur, Rod ^b,d  

^a University of Texas at Arlington   (United States)

^b SEMATECH   (United States)

^c TEXAS INSTRUMENTS   (United States)

^d IBM   (United States)

Author keywords

Cu interconnects; Electrical resistivity; Impurity scattering; Size effect; Surface scattering

Indexed keywords

COPPER; ELECTRIC CONDUCTIVITY OF SOLIDS; ELECTRON SCATTERING; HELIUM; METALLIC FILMS; TEMPERATURE;

DAMASCENE; IMPURITY SCATTERING; SURFACE SCATTERING;

NANOSTRUCTURED MATERIALS;

EID: 0242368013     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-003-0079-1     Document Type: Article

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