Improvement in step coverage of Pb(Zr,Ti)O3 thin films deposited by liquid delivery metalorganic chemical vapor deposition

Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers

Volumn 44, Issue 7 A, 2005, Pages 5133-5136

  Otani, Yohei ^a   Abe, Norikazu ^a   Miyake, Masato ^a   Okamura, Soichiro ^a   Shiosaki, Tadashi ^a  

^a NARA INSTITUTE OF SCIENCE AND TECHNOLOGY   (Japan)

Author keywords

Liquid delivery MOCVD; Low temperature deposition; PZT; Step coverage; Thin film

Indexed keywords

FERROELECTRICITY; LEAD COMPOUNDS; METALLORGANIC CHEMICAL VAPOR DEPOSITION;

LIQUID DELIVERY MOCVD; LOW-TEMPERATURE DEPOSITION; PZT; STEP COVERAGE;

THIN FILMS;

EID: 31544448277     PISSN: 00214922     EISSN: 13474065     Source Type: Journal    
DOI: 10.1143/JJAP.44.5133     Document Type: Article

References (12)

1. H. Takasu: J. Electroceram. 4 (2000) 327.
2. T. Yamazaki, K. Inoue, H. Miyazawa, M. Nakamura, N. Sashida, R. Satomi, A. Kerry, Y. Katoh, H. Nasiro, K. Takai, R. Shinohara, C. Ohno, T. Nakajima, Y. Furumura and S. Kawamura: IEDM Tech. Dig., 1997, p. 613.
3. The International Technology Roadmap for Semiconductors 2003 Front End Process, p. 53.
4. M. Aratani, T. Ozeki and H. Funakubo: Jpn. J. Appl. Phys. 40 (2001) L343.
5. H. Fujisawa, K. Kita, M. Shimizu and H. Niu: Jpn. J. Appl. Phys. 40 (2001) 5551.
6. M. Shimizu, M. Okaniwa, H. Fujisawa and H. Niu: Jpn. J. Appl. Phys. 41 (2002) 6686.
7. Y. Horii, Y. Hikosaka, A. Itoh, K. Matsuura, M. Kurasawa, G. Komuro, K. Maruyama, T. Eshita and S. Kashiwagi: IEDM Tech. Dig., 2002, p. 539.
8. M. Miyake, K. Lee, S. Kawasaki, Y. Ueda, S. Okamura and T. Shiosaki: Jpn. J. Appl. Phys. 41 (2002) 241.
9. Y. Ueda, N. Abe, Y. Otani, M. Miyake, S. Okamura and T. Shiosaki: Integrat. Ferroelctr. 46 (2002) 125.
10. T. Shiosaki, S. Okamura, M. Miyake, Y. Otani and N. Abe: Ferroelectrics 293 (2003) 69.
11. M. Miyake, K. Lee, T. Nishida, S. Okamura and T. Shiosaki: 12th IEEE Int. Symp. Applications of Ferroelectrics, Technical Program Book, 2000, p. 126.
12. Y. Otani, N. Abe, Y. Ueda, M. Miyake, S. Okamura and T. Shiosaki: Integrat. Ferroelctr. 51 (2003) 63.