SCOPUS 정보 검색 플랫폼

Journal of Applied Physics

Volumn 96, Issue 1, 2004, Pages 82-93

Pulsed plasmas as a method to improve uniformity during materials processing

(2) Subramonium, Pramod a,c Kushner, Mark J b

a UNIVERSITY OF ILLINOIS AT URBANA CHAMPAIGN (United States)

b University of Illinois at Urbana Champaign (United States)

c Novellus Systems Inc (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ION-ION PLASMA; LANGMUIR PROBE; MATERIALS PROCESSING; PLASMA CONDUCTIVITY;

COMPUTATIONAL METHODS; DEPOSITION; ELECTRIC REACTORS; ELECTRONS; FEEDBACK; FINITE ELEMENT METHOD; INDUCTIVELY COUPLED PLASMA; IONIZATION; MICROELECTRONICS; PARAMETER ESTIMATION; PLASMA DENSITY; PLASMA ETCHING;

MATERIALS SCIENCE;

EID: 3142694887 PISSN: 00218979 EISSN: None Source Type: Journal
DOI: 10.1063/1.1751636 Document Type: Article

Times cited : (56)

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