H-induced platelet and crack formation in hydrogenated epitaxial Si/Si 0.98B 0.02/Si structures

Applied Physics Letters

Volumn 88, Issue 2, 2006, Pages 1-3

  Shao, Lin ^a   Lin, Yuan ^a   Swadener, J G ^a   Lee, J K ^a   Jia, Q X ^a   Wang, Y Q ^a   Nastasi, M ^a   Thompson, Phillip E ^b   Theodore, N David ^c   Alford, T L ^d   Mayer, J W ^d   Chen, Peng ^e   Lau, S S ^e  

^a LOS ALAMOS NATIONAL LABORATORY   (United States)

^b NAVAL RESEARCH LABORATORY   (United States)

^c FREESCALE SEMICONDUCTOR INC   (United States)

^d Arizona State University   (United States)

^e UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DEFECT FORMATION; PLATELET FORMATION;

CRACK INITIATION; HYDROGENATION; MOLECULAR BEAM EPITAXY; MOLECULAR STRUCTURE; SILICON ON INSULATOR TECHNOLOGY; SILICON WAFERS;

SILICON COMPOUNDS;

EID: 30844433075     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2163992     Document Type: Article

References (14)

1. M. Bruel, Nucl. Instrum. Methods Phys. Res. B 108, 313 (1996).
2. T. Höchbauer, A. Misra, M. Nastasi, and J. W. Mayer, J. Appl. Phys. 89, 5980 (2001).
3. M. K. Weldon, V. E. Marsico, Y. J. Chabal, A. Agarwal, D. J. Eaglesham, J. Sapjeta, W. L. Brown, D. C. Jacobson, Y. Caudano, S. B. Christman, and E. E. Chaban, J. Vac. Sci. Technol. B 15, 1065 (1997).
4. M. Nastasi, T. Höchbauer, J. K. Lee, A. Misra, J. P. Hirth, M. Ridgway, and T. Lafford, Appl. Phys. Lett. 86, 154102 (2005).
5. International Technology Roadmap for Semiconductors (Semiconductor Industry Association, Palo Alto, CA, 2003), http://public.itrs.net
6. C. Qian, B. Terreault, and S. C. Gujrathi, Nucl. Instrum. Methods Phys. Res. B 175-177, 711 (2001).
7. A. Usenko, J. Electron. Mater. 32, 872 (2003).
8. P. Chen, P. K. Chu, T. Höchbauer, J.-K. Lee, M. Nastasi, D. Buca, S. Mantl, R. Loo, M. Caymax, T. Alford, J. W. Mayer, N. D. Theodore, M. Cai, B. Schmidt, and S. S. Lau, Appl. Phys. Lett. 86, 031904 (2005).
9. N. H. Nickel, G. B. Anderson, N. M. Johnson, and J. Walker, Phys. Rev. B 62, 8012 (2000).
10. G. Dieter, Mechanical Metallurgy, 3rd ed. (McGraw-Hill, New York, 1986).
11. L. Shao, Y. Lin, J. K. Lee, Q. X. Jia, Y. Q. Wang, M. Nastasi, P. E. Thompson, N. David Theodore, P. K. Chu, T. L. Alford, J. W. Mayer, P. Chen, and S. S. Lau, Appl. Phys. Lett. 87, 091902 (2005).
12. L. Fedina, O. I. Lebedev, G. Van Tendeloo, J. Van Landuyt, O. A. Mironov, and E. H. C. Parker, Phys. Rev. B 61, 10336 (2000).
13. F. A. Reboredo, M. Ferconi, and S. T. Pantelides, Phys. Rev. Lett. 82, 4870 (1999).
14. H. Tada, P. C. Paris, and G. R. Irwin, The Stress Analysis of Cracks Handbook (Del Research Corp., Hellertown, PA, 1985).