Low temperature eutectic bonding for in-plane type micro thermoelectric cooler

ASME International Mechanical Engineering Congress and Exposition, Proceedings

Volumn 2, Issue , 2001, Pages 3291-3294

  Yao, Da Jeng ^a   Chen, Gang ^a   Kim, Chang Jin ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; COOLING SYSTEMS; EUTECTICS; HIGH TEMPERATURE EFFECTS; LOW TEMPERATURE EFFECTS; MICROELECTROMECHANICAL DEVICES; MICROMACHINING; MOLECULAR BEAM EPITAXY; OPTOELECTRONIC DEVICES; SEEBECK EFFECT; SUPERLATTICES;

BONDING METHODS; THERMOELECTRIC COOLERS;

THERMOELECTRIC EQUIPMENT;

EID: 1542411491     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

1. L. Dubois, "An Introduction to the DARPA program in Advanced Thermoelectric Materials and Devices," at 18th International Conference on Thermoelectrics, Baltimore, USA, 1999, pp. 1-4.
2. R. C. Chu and R. E. Simons, "Application of Thermoelectrics to Cooling Electronics: Review and Prospects," at 18th International Conference on Thermoelectrics, Baltimore, USA, 1999, pp. 270-279.
3. J. Schieferdecker, R. Quad, and E. Holzenkampfer. "Infrared thermopile sensors with high sensitivity and very low temperature coefficient," Sensors and Actuators: A, vol. 46-47, pp. 422-427, 1995.
4. R. Venkatasubramanian, E. Siivola, and T. S. Colpitts. "In-Plane Thermoelectric Properties of Freestanding Si/Ge Superlattice Structures," at 17th International Conference on Thermoelectrics, Japan, 1998, pp. 191-197.
5. D.-J. Yao, G. Chen, and C. Kim, "Design of Thin-Film Thermoelectric Microcoolers," at IMECE2000, Orlando, FL USA, 2000, pp. 345-351.
6. R. F. Wolffenbuttel, "Low-temperature intermediate Au-Si wafer bonding; eutectic or suicide bond," Sensors and Actuators A-Physical, vol. 62, pp. 680-686, 1997.
7. C. C. Lee, C. Y. Wang, and G. Matijasevic, "Au-In Bonding Below the Eutectic Temperature," IEEE Transactions on components, hybrids, and manufacturing technology, vol. 16, pp. 311-316, 1993.