Thermal stability of low dielectric constant porous silica films

Applied Physics Letters

Volumn 87, Issue 26, 2005, Pages 1-3

  Esposito, L ^a   Ottaviani, G ^a   Carollo, E ^b   Bacchetta, M ^b  

^a UNIVERSITY OF MODENA AND REGGIO EMILIA   (Italy)

^b STMICROELECTRONICS   (Italy)

Author keywords

[No Author keywords available]

Indexed keywords

CARBON; CHEMICAL VAPOR DEPOSITION; HEAT TREATMENT; NANOSTRUCTURED MATERIALS; PERMITTIVITY; POROSITY; POROUS SILICON; SILICA; THIN FILMS;

DEUTERATED WATER VAPOR; LOW DIELECTRIC CONSTANT POROUS SILICA FILMS; PERMEATION EXPERIMENTS; POLARIZABILITY;

THERMODYNAMIC STABILITY;

EID: 29744444904     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2159093     Document Type: Article

References (10)

1. International Technology Roadmap for Semiconductors, 2004 Update, available on line at http://public.itrs.net/
2. K. Maex, M. R. Baklanov, D. Shamiryan, F. Iacopi, S. H. Brongersma, and Z. S. Yanovitskaya, J. Appl. Phys. 93, 8793 (2003).
3. A. Grill and V. Patel, J. Appl. Phys. 85, 3314 (1999).
4. J. Y. Kim, M. S. Hwang, Y.-H. Kim, H. J. Kim, and Y. Lee, J. Appl. Phys. 90, 2469 (2001).
5. R. S. Brusa, M. Spagolla, G. P. Karwasz, A. Zecca, G. Ottaviani, F. Corni, M. Bacchetta, and E. Carollo, J. Appl. Phys. 95, 2348 (2004).
6. H.-J. Lee, E. K. Lin, B. J. Bauer, and W.-L. Wu, Appl. Phys. Lett. 82, 1084 (2003).
7. A. Monelli, F. Corni, R. Tonini, C. Ferrari, G. Ottaviani, L. Canotti, and G. Queirolo, J. Appl. Phys. 80, 109 (1996).
8. F. Corni, A. Monelli, G. Ottaviani, R. Tonini, G. Queirolo, and L. Canotti, J. Non-Cryst. Solids 216, 71 (1997).
9. C. Macchi, G. Mariotto, G. P. Karwasz, A. Zecca, M. Bettonte, and R. S. Brusa, Mater. Sci. Semicond. Process. 7, 289 (2004).
10. M. Morgen, E. T. Ryan, J.-H. Zhao, C. Hu, T. Cho, and P. S. Ho, Annu. Rev. Mater. Sci. 30, 645 (2000).