Investigation of moisture-assisted fracture in SiO2 films using a channel cracking technique

Acta Materialia

Volumn 52, Issue 12, 2004, Pages 3621-3629

  McElhaney, Kevin W ^a   Ma, Qing ^a  

^a INTEL CORPORATION   (United States)

Author keywords

Subcritical crack growth; Thin film toughness

Indexed keywords

COMPRESSIVE STRESS; CRACK INITIATION; CRACK PROPAGATION; FRACTURE TOUGHNESS; MOISTURE; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; SILICA; TENSILE STRESS;

CRACK VELOCITY; ENVIRONMENTAL KINETICS; SUBCRITICAL CRACK GROWTH; THIN-FILM TOUGHNESS;

THIN FILMS;

EID: 2942704330     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.actamat.2004.04.014     Document Type: Article

References (20)

1. Lawn B.R. Fracture of brittle solids. 2nd ed. 1993;Cambridge University Press, Cambridge.
2. Ostojic P. Review: stress enhanced environmental corrosion and lifetime prediction modeling in silica optical fibres. J. Mater. Sci. 30:1995;3011-3023.
3. 4 ceramics. J. Am. Ceram. Soc. 83(3):2000;585-596.
4. Cook R.F., Liniger E.G. Stress-corrosion cracking of low-dielectric- constant spin-on-glass thin films. J. Electrochem. Soc. 146:1999;4439-4448.
5. 2 interfaces in multiplayer thin-films. Acta Metall. Mater. 47:1999;4131-4141.
6. Michalske TA, Bunker BC. The fracture of glass. Scientific American, vol. 255; 1987. p. 122-9.
7. Weiderhorn S.M. Influence of water vapor on crack propagation in soda-lime class. J. Am. Ceram. Soc. 59:1967;407.
8. Lee Y.H., Kwon D. Evaluation of fracture toughness through the modeling of indentation residual stress field and crack shape. Key Eng. Mater. 161-163:1999;569-572.
9. Pharr G.M., Harding D.S., Oliver W.C. Measurement of fracture toughness in thin films and small volumes using nanoindentation methods. Mechanical properties and deformation behavior of materials having ultra-fine microstructures. 1993;Kluwer Academic Publishers, Dordrecht. p. 449-61.
10. Sharpe Jr WN, Brown S, Johnson GC, Knauss W. In: Round-Robin Tests of Modulus and Strength of Polysilicon in Materials Research Society Symposium N: Microelectromechanical Structures for Materials Research Proceedings, San Francisco, CA, April 15-16; 1998. p 57-65.
11. de Boer, MP, Jensen BD, Bitsie F. A small area in-situ MEMS test structure to measure fracture strength by electrostatic probing. In: SPIE Proceedings. Materials and Device Characterization in Micromachining, Santa Clara, CA, September. vol. 3875; 1999.
12. Ma Q., Xie J., Chao S., El-Mansy S., Mcfadden R., Fujimoto H. Bravman J., Marieb T., Lloyd J., Korhonen M. Materials Reliability in Microelectronics VIII. Material Research Society Proceedings, Pittsburgh, PA. vol. 516:1998;331-336.
13. Hutchinson J.W., Suo Z. Mixed mode cracking in layered materials. Adv. Appl. Mech. 29:1992;63-191.
14. Beuth J.L., Klingbeil N.W. Cracking of thin films bonded to elastic-plastic substrates. J. Mech. Phys. Solids. 44:1996;1411-1428.
15. Begley M.R., Evans A.G. Progressive cracking of a multilayer system upon thermal cycling. J. Appl. Mech. 68:2001;513-520.
16. Hu M.S., Evans A.G. The cracking and decohesion of thin films on ductile substrates. Acta Metall. 37:1989;917-925.
17. Gere J.M., Timoshienko S.P. Mechanics of materials. 3rd ed. 1990;PWS Publishing Company, Boston.
18. McInerney E.J., Flinn P.A. Diffusivity of moisture in thin films. International Reliability Physics Symposium, 20th Annual Proceedings. 1982;264-267 IEEE, New York.
19. 2. J. Appl. Phys. 88:2000;3695-3698.
20. Sun J.N., Gidley D.W., Dull T.L., et al. Probing diffusion barrier integrity on porous silica low-k thin films using positron annihilation lifetime spectroscopy. J. Appl. Phys. 89(9):2001;5138-5144.