Circuit level reliability analysis of Cu interconnects

Proceedings - 5th International Symposium on Quality Electronic Design, ISQUED 2004

Volumn , Issue , 2004, Pages 238-243

  Alam, Syed M ^a   Lip, Gan Chee ^b   Thompson, Carl V ^a   Troxel, Donald E ^a  

^a MASSACHUSETTS INSTITUTE OF TECHNOLOGY   (United States)

^b NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTATION THEORY; COMPUTER AIDED DESIGN; COMPUTER SIMULATION; COPPER; MATHEMATICAL MODELS; RELIABILITY; TREES (MATHEMATICS);

CIRCUIT LAYOUTS; CIRCUIT LEVEL RELIABILITY; COPPER BASED INTERCONNECT TECHNOLOGY; DESIGN TIME ANALYSIS;

INTEGRATED CIRCUITS;

EID: 2942666104     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISQED.2004.1283680     Document Type: Conference Paper

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