Effect of current direction on the reliability of different capped Co interconnects

Materials Research Society Symposium Proceedings

Volumn 863, Issue , 2005, Pages 289-294

  Gan, C L ^a   Lee, C Y ^a   Cheng, C K ^b   Gambino, J ^c  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^b INSTITUTE OF MICROELECTRONICS   (Singapore)

^c IBM MICROELECTRONICS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DIFFUSION; FAILURE ANALYSIS; LARGE SCALE SYSTEMS; SILICON NITRIDE;

CO INTERCONNECTS; ELECTRICAL CURRENT FLOW; ELECTRON CURRENT FLOW;

COBALT;

EID: 28844458431     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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