Plasma activated wafer bonding for MEMS

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 5836, Issue , 2005, Pages 179-187

  Dragoi, V ^a   Farrens, S ^a   Lindner, P ^a  

^a EV GROUP   (Austria)

Author keywords

Low temperature processing; MEMS; Plasma activation; Wafer bonding

Indexed keywords

OXIDES; PLASMAS; POLYMERS; RAPID THERMAL ANNEALING; SEMICONDUCTOR DEVICES; SILICON; WSI CIRCUITS;

LOW TEMPERATURE PROCESSING; PLASMA ACTIVATION; WAFER BONDING;

MICROELECTROMECHANICAL DEVICES;

EID: 28344450147     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.608788     Document Type: Conference Paper

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