Low temperature wafer bonding for microsystems applications

Proceedings of the International Semiconductor Conference, CAS

Volumn 1, Issue , 2004, Pages 199-202

  Dragoi, V ^a   Farrens, S ^a   Lindner, P ^a   Weixlberger, J ^a  

^a EV GROUP   (Austria)

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVATION ANALYSIS; BONDING; LOW TEMPERATURE EFFECTS; OPTIMIZATION; SURFACE TREATMENT; WSI CIRCUITS;

LOW TEMPERATURE WAFER BONDING; MECHANICAL STRUCTURES; MEMS DEVICES; MICROSYSTEMS;

MICROELECTROMECHANICAL DEVICES;

EID: 27844449446     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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