A new approach for detecting defects in bonded MEMS devices

Experimental Techniques

Volumn 28, Issue 5, 2004, Pages 19-22

  Horn, G ^a   Mackin, T ^a   Lesniak, J ^b   Boyce, Brad ^b  

^a UNIVERSITY OF ILLINOIS AT URBANA CHAMPAIGN   (United States)

^b Stress Photonics Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ACOUSTIC MICROSCOPES; DEFECTS; INFRARED IMAGING; MATHEMATICAL MODELS; PHOTOELASTICITY; POLARISCOPES; RESIDUAL STRESSES; SHEAR STRESS;

BONDED DEVICES; DETECTING DEFECTS; INFRARED GREY FIELD POLARISCOPE; INFRARED TRANSMISSION IMAGING; WAFER BONDING; X RAY TOPOGRAPHY;

MICROELECTROMECHANICAL DEVICES;

EID: 6444226794     PISSN: 07328818     EISSN: None     Source Type: Journal    
DOI: 10.1111/j.1747-1567.2004.tb00181.x     Document Type: Article

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