Characterization of Sputtered Titanium Carbide Film as Diffusion Barrier for Copper Metallization

Journal of the Electrochemical Society

Volumn 148, Issue 8, 2001, Pages

  Wang, Shui Jinn ^a   Tsai, Hao Yi ^a   Sun, S C ^b  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

^b Wafertech Research and Development   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0012438337     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1385378     Document Type: Article

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