Polymer optical interconnect technology (POINT): Optoelectronic packaging and interconnect for board and backplane applications

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 10284, Issue , 1996, Pages 405-414

  Liu, Y S ^a   Wojnarowski, R J ^a   Hennessy, W B ^a   Bristow, Julian P G ^b   Liu, Yue ^b   Peczalski, Andrzej ^b   Rowlette, John R ^c   Plotts, Alan ^c   Stack, Jared D ^c   Yardley, James T ^d   Eldada, Louay A ^d   Osgood, Richard M ^e   Scarmozzino, Robert ^e   Lee, Sing H ^f   Ozguz, Volkan H ^f  

^a GE GLOBAL RESEARCH   (United States)

^b HONEYWELL TECHNOLOGY CENTER   (United States)

^c Technology Group AMP   (United States)

^d AlliedSignal Research and Technology Center   (United States)

^e Columbia University ^*  (United States)

^f UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

Backplane and board level interconnect; High speed optical links; Optical interconnect; Optoelectronic packaging; Polyguide; Polymer waveguide; VCSEL packaging

Indexed keywords

DISTRIBUTED COMPUTER SYSTEMS; LIGHT TRANSMISSION; MILITARY APPLICATIONS; OPTICAL INTERCONNECTS; PACKAGING; POLYMERS; WAVEGUIDES; ALIGNMENT; COMPUTER SIMULATION; DESIGN; ELECTRONICS PACKAGING; FABRICATION; INDUSTRIAL APPLICATIONS; MODULAR CONSTRUCTION; OPTICAL WAVEGUIDES; OPTOELECTRONIC DEVICES; TECHNOLOGY;

BOARD-LEVEL; HIGH SPEED; OPTICAL INTERCONNECT; OPTOELECTRONIC PACKAGING; POLYGUIDE; POLYMER WAVEGUIDES; BOARD-TO-BACKPLANE INTERCONNECT; DIFFRACTIVE OPTICAL ELEMENTS;

OPTICAL FIBER COUPLING; OPTICAL INTERCONNECTS;

EID: 0029774684     PISSN: 0277786X     EISSN: 1996756X     Source Type: Conference Proceeding    
DOI: 10.1117/12.229274     Document Type: Conference Paper

References (11)

1. Y. S. Liu, H. S. Cole, J. P. Bristow and Yue Liu, "Polymcr-bascd optical interconnect technology: a route to low-cost optoelectronic packaging and interconnect, " in Optical Interconnect III, ed. by R. Chen, SPIE, p. 80, 1995.
2. Y. S. Liu, H. S. Cole, J. Bristow and Yue Liu, "Hybrid integration of electrical and optical interconnects, " in "Optical interconnect II, " ed. by R. Chen, Proc. SPIE, 1993.
3. Also, J. Bristow, C. Sullivan, S. Mukherjee, Yue Liu and A. Husain, "Progress and status of guided wave optical interconnect technology, " in "Optical Interconnects, " ed. by R. Chen, Vol. 1849, Proc. SPIE, pp. 4-10, (1993)
4. YM. Wong et al, "Technology development of a high density 32-channel 16 Gbps optical data link for optical interconnect applications for the optoelectronic technology Consortium (OETC), " to be published in IEEE Journal of Lightwave Technology.
5. W. S. Ishak, K. H. Hahn, B. L. Booth, E. H. Mueller, A. A. J. Levi, R. R. Craig, "Optical interconnects: the Parallel Optical Links Organization (POLO) approach, " in "Optical Interconnect III, " p. 214, 1995.
6. C. W. Eichelberger, et. al. SPIE "Symposium on Innovative Science and Technologies, " paper. 877, p. 15, 1988.
7. YS. Liu, "Laser metal deposition for high density interconnect, " in "Optics and Photonics News, " Optical Society of America, p. 10. June, 1992.
8. B. L. Booth, "Polymers for integrated optical waveguides, " in Polymers for electronics and photonic applications, ed by CP Wong, Academic Press, p. 549, 1993.
9. J. T Yardley, "Design and Characterization of organic waveguides for passive and active optical devices, " in Science and Technology of Organic thin films for waveguiding nonlinear optics, ed. by F. Kajzar and J. D. Swalen, 1994.
10. H. R. Philipp, D. G. LeGrand, H. S. Cole and Y. S. Liu, "The optical properties of a polyetherimide, " in "Polymer Engineering and Science': Vol. 29, No. 22, p. 1574, 1989.
11. J. PBristow, Yue Liu, T. Marta, S. Bounnak, K. Johnson, YS. Liu and H. S. Cole, "Cost-effective optoelectronic packaging for multichip modules and backplane-level optical interconnects, " in Optical Interconnect 111, SPIE, p. 61, 1995