Self-assembly for three-dimensional integration of functional electrical components

Journal of Micromechanics and Microengineering

Volumn 15, Issue 11, 2005, Pages 2172-2178

  Cannon, Andrew H ^a   Hua, Yueming ^b   Henderson, Clifford L ^b   King, William P ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^b Georgia Institute of Technology   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ACTUATORS; ELECTRONICS PACKAGING; MELTING; POLYMETHYL METHACRYLATES; POWER ELECTRONICS; SELF ASSEMBLY; SENSORS;

FUNCTIONAL ELECTRICAL COMPONENTS; POWER SOURCES; SERIAL MANUFACTURING;

MICROELECTRONICS;

EID: 27144541766     PISSN: 09601317     EISSN: None     Source Type: Journal    
DOI: 10.1088/0960-1317/15/11/025     Document Type: Article

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