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Volumn 15, Issue 11, 2005, Pages 2003-2010

A high yield rate MEMS gyroscope with a packaged SiOG process

Author keywords

[No Author keywords available]

Indexed keywords

FABRICATION; MICROELECTROMECHANICAL DEVICES; SEMICONDUCTING SILICON; SILICON ON INSULATOR TECHNOLOGY; SILICON WAFERS; THERMAL EXPANSION; VIBRATIONS (MECHANICAL);

EID: 27144536556     PISSN: 09601317     EISSN: None     Source Type: Journal    
DOI: 10.1088/0960-1317/15/11/003     Document Type: Article
Times cited : (47)

References (18)
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    • Active structural error suppression in MEMS vibratory rate integrating gyroscopes
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    • Painter, C.C.1    Shkel, A.M.2
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    • An inertial sensor technology using DRIE and wafer bonding with interconnecting capability
    • Ishihara K, Yung C F, Ayon A A and Schmidt M A 1999 An inertial sensor technology using DRIE and wafer bonding with interconnecting capability J. Microelectromech. Syst. 8 403-8
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    • Robust optimal design of a vibratory microgyroscope considering fabrication errors
    • Han J S and Kwak B M 2001 Robust optimal design of a vibratory microgyroscope considering fabrication errors J. Micromech. Microeng. 11 662-71
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.