Getters films at wafer level for wafer to wafer bonded MEMS

DTIP 2003 - Design, Test, Integration and Packaging of MEMS/MOEMS 2003

Volumn , Issue , 2003, Pages 346-349

  Moraja, M ^a   Amiotti, M ^a  

^a SAES GETTERS S P A   (Italy)

Author keywords

Ceramics; Commercialization; Costs; Gettering; Glass; Microelectromechanical devices; Micromechanical devices; Packaging; Semiconductor films; Wafer bonding

Indexed keywords

EID: 84945919371     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/DTIP.2003.1287065     Document Type: Conference Paper

References (2)

1. S. Caplet, N. Sillon, M.T. Delaye, P. Berruyer, "Vacuum wafer level packaging for MEMS applications" Proceedings of SPIE, SPIE, Vol. 4979, pp. 271-278, 2003.
2. J.M. Lafferty, Foundations of Vacuum Science and Technology, pp. 261-316, John Wiley & Sons, New York, 1998.