Analytical solutions for the stiffness and damping coefficients of squeeze films in MEMS devices with perforated back plates

Journal of Micromechanics and Microengineering

Volumn 15, Issue 11, 2005, Pages 2083-2092

  Mohite, S S ^a   Kesari, Haneesh ^b   Sonti, V R ^a   Pratap, Rudra ^a  

^a INDIAN INSTITUTE OF SCIENCE   (India)

^b INDIAN INSTITUTE OF TECHNOLOGY GUWAHATI   (India)

Author keywords

[No Author keywords available]

Indexed keywords

BOUNDARY CONDITIONS; COMPUTER SIMULATION; DAMPING; FINITE ELEMENT METHOD; MICROELECTROMECHANICAL DEVICES; NUMERICAL METHODS; REYNOLDS NUMBER; STIFFNESS;

DAMPING FORCES; DESIGN PARAMETERS; PRESSURE PATTERNS; REYNOLDS EQUATION;

THIN FILMS;

EID: 27144494551     PISSN: 09601317     EISSN: None     Source Type: Journal    
DOI: 10.1088/0960-1317/15/11/013     Document Type: Article

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