Electrical current phase transformation of Sn-9Zn-1Ag alloy

Materials Transactions

Volumn 46, Issue 8, 2005, Pages 1820-1824

  Hung, Fei Yi ^a   Wang, Chih Jung ^a   Lui, Truan Sheng ^a   Chen, Li Hui ^a  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

Author keywords

Electromigration; Lead free solder; Phase transformation; Tin zinc silver

Indexed keywords

ELECTRIC CURRENTS; ELECTROMIGRATION; EUTECTICS; HEAT TREATMENT; PHASE COMPOSITION; PHASE TRANSITIONS; SOLDERING;

ELECTRICAL CURRENT TESTING; LEAD-FREE SOLDER; THERMAL STRAIN; TIN-ZINC-SILVER;

TERNARY SYSTEMS;

EID: 26944491113     PISSN: 13459678     EISSN: None     Source Type: Journal    
DOI: 10.2320/matertrans.46.1820     Document Type: Article

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