-
1
-
-
0035506511
-
Wafer-to-wafer bonding of nonplanarized MEMS surfaces using solder
-
D. Sparks, et al., "Wafer-to-Wafer bonding of nonplanarized MEMS surfaces using solder," J. of Microm. and Microeng., vol. 11, pp. 630-634, 2001.
-
(2001)
J. of Microm. and Microeng.
, vol.11
, pp. 630-634
-
-
Sparks, D.1
-
2
-
-
0035017677
-
Vacuum packaging technology using localized aluminum/silicon-to-glass bonding
-
Y. T. Cheng, et al., "Vacuum packaging technology using localized aluminum/silicon-to-glass bonding," MEMS 2001, pp. 18-21. 2001.
-
(2001)
MEMS 2001
, pp. 18-21
-
-
Cheng, Y.T.1
-
6
-
-
1842447961
-
Miniaturized thin film thermal vacuum sensor
-
W.J. Alvesteffer, et al., "Miniaturized thin film thermal vacuum sensor," J. of VST, A,vol.13,pp.2980-5, 1995.
-
(1995)
J. of VST, A
, vol.13
, pp. 2980-2985
-
-
Alvesteffer, W.J.1
-
7
-
-
0009224857
-
High performance Pirani vacuum gauge
-
J.S. Shie, et al., "High performance Pirani vacuum gauge," J. of VSTA, vol. 13, pp. 2972-9, 1995.
-
(1995)
J. of VSTA
, vol.13
, pp. 2972-2979
-
-
Shie, J.S.1
-
8
-
-
0026399850
-
Microfabricated thermal absolute pressure sensor with on-chip digital front-end processor
-
C. H. Mastrangelo and R. S. Muller, "Microfabricated thermal absolute pressure sensor with on-chip digital front-end processor," J. of SSC, vol 26, no 12, 1991.
-
(1991)
J. of SSC
, vol.26
, Issue.12
-
-
Mastrangelo, C.H.1
Muller, R.S.2
-
9
-
-
0032650738
-
Package quality testing using integrated pressure sensor
-
M. Waelti, et al., "Package quality testing using integrated pressure sensor," J. of Microcircuits and Electronic Packaging, vol. 22, pp. 49-56, 1999.
-
(1999)
J. of Microcircuits and Electronic Packaging
, vol.22
, pp. 49-56
-
-
Waelti, M.1
-
10
-
-
0038155575
-
A doubly anchored surface micromachined Pirani gauge for vacuum package characterization
-
B. H. Stark, et al., "A doubly anchored surface micromachined Pirani gauge for vacuum package characterization," MEMS 2003, pp. 506-509.
-
MEMS 2003
, pp. 506-509
-
-
Stark, B.H.1
-
11
-
-
0024122016
-
An ultraminiature solid-state pressure sensor for a cardiovascular catheter
-
H.L. Chau, and K.D. Wise, "An ultraminiature solid-state pressure sensor for a cardiovascular catheter," IEEE Transactions on Electron Devices, vol. ED-35, no. 12, pp. 2355-62, 1988.
-
(1988)
IEEE Transactions on Electron Devices
, vol.ED-35
, Issue.12
, pp. 2355-2362
-
-
Chau, H.L.1
Wise, K.D.2
-
12
-
-
84944720009
-
A monolithic 3-axis silicon capacitive accelerometer with micro-g resolution
-
J. Chae, et al., "A monolithic 3-axis silicon capacitive accelerometer with micro-g resolution," Transducers 2003, pp. 81-84, 2003.
-
(2003)
Transducers 2003
, pp. 81-84
-
-
Chae, J.1
-
13
-
-
3042768653
-
On the conduction of heat in rarefied gases and its manometric application
-
H. V. Ubisch, "On the conduction of heat in rarefied gases and its manometric application," Appl. Sci. Res., vol. A2, pp. 364-430, 1948.
-
(1948)
Appl. Sci. Res.
, vol.A2
, pp. 364-430
-
-
Ubisch, H.V.1
-
14
-
-
0005736381
-
The effect of accommodation on heat conduction through gases
-
B. G. Dicking, "The effect of accommodation on heat conduction through gases," Proc. Roy. Soc. A, vol. 143, pp. 517-540, 1934.
-
(1934)
Proc. Roy. Soc. A
, vol.143
, pp. 517-540
-
-
Dicking, B.G.1
-
15
-
-
0003713895
-
-
Ph.D. Thesis, Electrical Engineering and Computer Science at The University of California, Berkeley, CA
-
C.H. Mastrangelo, Ph.D. Thesis, "Thermal applications of microbridges," in Electrical Engineering and Computer Science at The University of California, Berkeley, CA, 1991.
-
(1991)
Thermal Applications of Microbridges
-
-
Mastrangelo, C.H.1
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