Anodic bonding below 180 °C for packaging and assembling of MEMS using lithium aluminosilicate-β-quartz glass-ceramic

Proceedings of the IEEE Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 1997, Pages 482-487

  Shoji, Shuichi ^a   Kikuchi, Hiroto ^a   Torigoe, Hirotaka ^a  

^a WASEDA UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; ELECTRONICS PACKAGING; ETCHING; GLASS; HYDROFLUORIC ACID; INTEGRATED CIRCUIT MANUFACTURE; INTERFACES (MATERIALS); MASKS; SILICATES; THERMAL EXPANSION;

ANODIC BONDING; LITHIUM ALUMINOSILICATE; WET ETCHING;

MICROELECTROMECHANICAL DEVICES;

EID: 0030712718     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (9)